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| AG604-89 InGaP HBT Gain Block Product Information Product Features * * * * * * * DC - 2700 MHz +19.5 dBm P1dB at 900 MHz +33.5 dBm OIP3 at 900 MHz 21 dB Gain at 900 MHz Single Voltage Supply Internally matched to 50 Lead-free/Green/RoHScompliant SOT-89 Package * MTTF > 1000 years Product Description The AG604-89 is a general-purpose buffer amplifier that offers high dynamic range in a low-cost surface-mount package. At 900 MHz, the AG604-89 typically provides 21 dB of gain, +33.5 dBm Output IP3, and +19.5 dBm P1dB. The device combines dependable performance with superb quality to maintain MTTF values exceeding 1000 years at mounting temperatures of +85C and is available in the environmentally-friendly lead-free/green/RoHS-compliant SOT-89 package. The AG604-89 consists of Darlington pair amplifiers using the high reliability InGaP/GaAs HBT technology process technology and only requires DC-blocking capacitors, a bias resistor, and an inductive RF choke for operation. The broadband MMIC amplifier can be directly applied to various current and next generation wireless technologies such as GPRS, GSM, CDMA, and W-CDMA. In addition, the AG604-89 will work for other various applications within the DC to 2.7 GHz frequency range such as CATV and fixed wireless. Functional Diagram GND 4 1 RF IN 2 GND 3 RF OUT Applications * * * * * * Mobile Infrastructure CATV / DBS W-LAN / ISM RFID Defense / Homeland Security Fixed Wireless Function Input Output/Bias Ground Pin No. 1 3 2, 4 Specifications (1) Parameter Operational Bandwidth Test Frequency Gain Input Return Loss Output Return Loss Output IP3 (2) Output IP2 Output P1dB Noise Figure Test Frequency Gain Output IP3 (2) Output P1dB Device Voltage Device Current Typical Performance (1) Units MHz MHz dB dB dB dBm dBm dBm dB MHz dB dBm dBm V mA Min DC Typ 900 21.4 20 12 +33.4 +45 +19.4 3.5 1900 18.2 +33.2 +19 5.16 75 Max 2700 Parameter Frequency S21 S11 S22 Output P1dB Output IP3 (2) Noise Figure Units MHz dB dB dB dBm dBm dB 500 22.5 -18 -16 +19.4 +33.5 3.5 Typical 900 21.4 -20 -12 +19.4 +33.4 3.5 1900 18.2 -35 -10 +19.0 +33.2 3.8 2140 17.6 -25 -10 +19.0 +32.9 3.8 17.2 19.2 1. Test conditions: 25 C, Supply Voltage = +6 V, Rbias = 11.2 , 50 System. 2. 3OIP measured with two tones at an output power of +2 dBm/tone separated by 10 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. Absolute Maximum Rating Parameter Operating Case Temperature Storage Temperature DC Voltage RF Input Power (continuous) Junction Temperature Rating -40 to +85 C -55 to +150 C +7 V +10 dBm +250 C Ordering Information Part No. AG604-89* AG604-89G AG604-89PCB Description InGaP HBT Gain Block (lead-tin SOT-89 Pkg) InGaP HBT Gain Block (lead-free/green/RoHS-compliant SOT-89 Pkg) 700 - 2400 MHz Fully Assembled Eval. Board Operation of this device above any of these parameters may cause permanent damage. * This package is being phased out in favor of the green package type which is backwards compatible for existing designs. Refer to Product Change Notification WJPCN06MAY05TC1 on the WJ website. Specifications and information are subject to change without notice Page 1 of 6 June 2005 WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com AG604-89 InGaP HBT Gain Block Product Information Typical Device RF Performance Supply Bias = +6 V, Rbias = 11.2 , Icc = 75 mA Frequency S21 S11 S22 Output P1dB Output IP3 Noise Figure MHz dB dB dB dBm dBm dB 100 23.2 -20 -29 +19.4 +33.6 3.4 500 22.5 -18 -16 +19.4 +33.5 3.5 900 21.4 -20 -12 +19.4 +33.4 3.5 1900 18.2 -35 -10 +19.0 +33.2 3.8 2140 17.6 -25 -10 +19.0 +32.9 3.8 2400 16.9 -25 -10 +18.8 +32.4 3.9 3500 14.4 -19 -8 +16.2 5800 10.1 -15 -6 1. Test conditions: T = 25 C, Supply Voltage = +6 V, Device Voltage = 5.16 V, Rbias = 11.2 , Icc = 75 mA typical, 50 System. 2. 3OIP measured with two tones at an output power of +2 dBm/tone separated by 10 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit. Gain vs. Frequency 24 22 Gain (dB) Return Loss 0 Device Current (mA) I-V Curve 120 100 80 60 40 20 0 3.4 3.8 4.2 4.6 5.0 5.4 5.8 Optimal operating point 20 18 16 14 12 0 -40 C 1 +25 C +85 C 3 4 S11, S22 (dB) -10 -20 -30 S11 S22 -40 2 Frequency (GHz) 0 1 2 3 4 5 6 Frequency (GHz) Output IP2 vs. Frequency Device Voltage (V) Noise Figure vs. Frequency Output IP3 vs. Frequency 40 35 30 25 -40 C +25 C +85 C 50 45 40 35 -40 C +25 C +85 C 5 4 NF (dB) 3 2 1 -40 C +25 C +85 C OIP3 (dBm) 20 0 0.5 1 1.5 2 2.5 3 Frequency (GHz) P1dB vs. Frequency OIP2 (dBm) 30 0 0 200 400 600 800 1000 0 0.5 1 1.5 2 2.5 3 Frequency (MHz) Output Power / Gain vs. Input Power 22 20 Gain (dB) frequency = 900 MHz Frequency (GHz) Output Power / Gain vs. Input Power 24 Output Power (dBm) frequency = 2000 MHz 20 15 10 5 -40 C +25 C +85 C 18 16 Gain (dB) 24 Output Power (dBm) P1dB (dBm) Gain 20 16 12 Output Power 8 4 Gain 20 16 12 8 Output Power 4 18 16 14 14 12 10 8 -12 -8 -4 0 Input Power (dBm) 4 8 0 0 0.5 1 1.5 2 2.5 3 3.5 4 Frequency (GHz) 12 -12 -8 -4 0 Input Power (dBm) 4 8 Specifications and information are subject to change without notice WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com Page 2 of 6 June 2005 AG604-89 InGaP HBT Gain Block Product Information Typical Device RF Performance (cont'd) Supply Bias = +8 V, Rbias = 38 , Icc = 75 mA Gain vs. Frequency 24 22 Gain (dB) Output IP3 vs. Frequency Output IP2 vs. Frequency 40 35 30 25 -40 C +25 C +85 C 50 45 40 35 -40 C +25 C +85 C 20 18 16 14 12 0 -40 C 1 +25 C +85 C 3 4 OIP3 (dBm) 20 0 0.5 1 1.5 2 2.5 3 Frequency (GHz) P1dB vs. Frequency OIP2 (dBm) 30 2 Frequency (GHz) 0 200 400 600 800 1000 Frequency (MHz) Noise Figure vs. Frequency 20 15 10 5 -40 C +25 C +85 C 5 4 NF (dB) 3 2 1 -40 C +25 C +85 C P1dB (dBm) 0 0 0.5 1 1.5 2 2.5 3 3.5 4 Frequency (GHz) 0 0 0.5 1 1.5 2 2.5 3 Frequency (GHz) Vcc Icc = 75 mA Application Circuit R1 Bias Resistor C4 Bypass Capacitor C3 0.018 F L1 RF Choke RF IN AG604-89 C1 Blocking Capacitor C2 Blocking Capacitor RF OUT Recommended Component Values Reference Designator 50 500 L1 820 nH 220 nH C1, C2, C4 .018 F 1000 pF Ref. Desig. L1 C1, C2 C3 C4 R1 Frequency (MHz) 900 1900 2200 68 nH 27 nH 22 nH 100 pF 68 pF 68 pF Size 0603 0603 0603 0805 2500 18 nH 56 pF 3500 15 nH 39 pF 1. The proper values for the components are dependent upon the intended frequency of operation. 2. The following values are contained on the evaluation board to achieve optimal broadband performance: Value / Type 39 nH wirewound inductor 56 pF chip capacitor 0.018 F chip capacitor Do Not Place 10.0 1% tolerance Recommended Bias Resistor Values S upply R1 value S ize Voltage 6V 11.2 ohms 0805 7V 24.5 ohms 1210 8V 38 ohms 1210 9V 51 ohms 2010 10 V 65 ohms 2010 12 V 91 ohms 2512 The proper value for R1 is dependent upon the supply voltage and allows for bias stability over temperature. WJ recommends a minimum supply bias of +6 V. A 1% tolerance resistor is recommended. Specifications and information are subject to change without notice WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com Page 3 of 6 June 2005 AG604-89 InGaP HBT Gain Block Product Information AG604-89 (SOT-89 Package) Mechanical Information This package may contain lead-bearing materials. The plating material on the leads is SnPb. Outline Drawing Product Marking The AG604-89 will be marked with "AG604" designator. An alphanumeric code ("XXXX-X") is also marked below part designator on the top surface of package. an lot the the Tape and reel specifications for this part are located on the website in the "Application Notes" section. MSL / ESD Rating ESD Rating: Value: Test: Standard: Class 1C Passes at 1000 V min. Human Body Model (HBM) JEDEC Standard JESD22-A114 Class IV Passes at 1000 V min. Charged Device Model (CDM) JEDEC Standard JESD22-C101 Land Pattern ESD Rating: Value: Test: Standard: MSL Rating: Level 3 at +235 C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135") diameter drill and have a final plated thru diameter of .25 mm (.010"). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Thermal Specifications Parameter Operating Case Temperature Thermal Resistance, Rth (1) Junction Temperature, Tjc (2) -40 to +85C 154 C/W 145 C MTTF (million hrs) Rating 1000 MTTF vs. GND Tab Temperature 100 1. The thermal resistance is referenced from the hottest part of the junction to the ground tab (pin 4). 2. This corresponds to the typical biasing condition of +5.16V, 75 mA at an 85C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 177 C. 10 1 60 70 80 90 100 110 Tab Temperature (C) 120 Specifications and information are subject to change without notice WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com Page 4 of 6 June 2005 AG604-89 InGaP HBT Gain Block Product Information AG604-89G (Green / Lead-free SOT-89 Package) Mechanical Information This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260C reflow temperature) and leaded (maximum 245C reflow temperature) soldering processes. The plating material on the leads is NiPdAu. Outline Drawing Product Marking The AG604-89G will be marked with "A604G" designator. An alphanumeric code ("XXXX-X") is also marked below part designator on the top surface of package. an lot the the Tape and reel specifications for this part are located on the website in the "Application Notes" section. MSL / ESD Rating Land Pattern ESD Rating: Value: Test: Standard: ESD Rating: Value: Test: Standard: Class 1C Passes at 1000 V min. Human Body Model (HBM) JEDEC Standard JESD22-A114 Class IV Passes at 1000 V min. Charged Device Model (CDM) JEDEC Standard JESD22-C101 MSL Rating: Level 3 at +260 C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135") diameter drill and have a final plated thru diameter of .25 mm (.010"). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Thermal Specifications Parameter Operating Case Temperature Thermal Resistance, Rth (1) Junction Temperature, Tjc (2) -40 to +85C 154 C/W 145 C MTTF (million hrs) Rating 1000 MTTF vs. GND Tab Temperature 100 1. The thermal resistance is referenced from the hottest part of the junction to the ground tab (pin 4). 2. This corresponds to the typical biasing condition of +5.16V, 75 mA at an 85C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 177 C. 10 1 60 70 80 90 100 110 Tab Temperature (C) 120 Specifications and information are subject to change without notice WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com Page 5 of 6 June 2005 AG604-89 InGaP HBT Gain Block Product Information Typical Device Data S-Parameters (Vdevice = +5.16 V, ICC = 75 mA, T = 25C, calibrated to device leads) Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) 50 200 400 600 800 1000 1200 1400 1600 1800 2000 2200 2400 2600 2800 3000 3200 3400 3600 3800 4000 4200 4400 4600 4800 5000 5200 5400 5600 5800 6000 -19.47 -19.99 -18.74 -18.61 -19.31 -20.44 -21.66 -24.20 -27.36 -34.02 -37.24 -26.80 -27.37 -28.58 -28.04 -27.15 -24.47 -20.69 -17.68 -15.38 -13.64 -12.54 -11.96 -11.70 -11.95 -12.38 -13.45 -14.33 -15.01 -15.26 -14.07 -179.76 164.44 154.62 146.21 136.13 125.97 121.75 110.39 105.17 88.22 17.00 5.55 -13.48 -13.99 -12.62 12.44 38.61 50.46 56.27 59.08 60.20 59.19 58.40 58.11 56.50 53.65 49.80 42.28 29.76 14.80 -3.83 23.04 22.87 22.53 22.08 21.54 20.84 20.19 19.58 18.91 18.28 17.69 17.24 16.74 16.41 15.90 15.45 14.91 14.40 13.88 13.36 12.79 12.26 11.80 11.40 11.07 10.83 10.59 10.34 10.14 9.93 9.61 176.18 165.24 150.94 137.54 125.11 113.40 102.48 92.78 83.35 74.49 65.83 58.03 49.91 44.54 36.48 28.12 20.63 12.37 4.46 -2.66 -10.18 -17.13 -24.01 -30.74 -37.60 -44.59 -51.57 -58.93 -66.97 -75.03 -83.70 -24.72 -25.12 -25.26 -25.23 -25.10 -25.08 -24.95 -24.70 -24.45 -24.24 -23.79 -23.50 -22.95 -22.78 -22.26 -21.90 -21.72 -21.85 -21.62 -21.34 -20.92 -20.96 -20.75 -20.64 -20.46 -20.08 -19.77 -19.61 -19.29 -19.18 -19.13 2.54 -1.44 -2.18 -2.40 -4.01 -6.19 -6.83 -7.39 -7.48 -9.76 -11.52 -11.92 -15.41 -21.31 -22.23 -24.55 -26.77 -30.57 -37.37 -42.35 -46.10 -49.06 -53.85 -58.65 -62.35 -67.44 -72.42 -78.05 -82.36 -89.72 -96.07 -33.40 -24.71 -17.84 -15.19 -13.08 -11.86 -10.97 -10.50 -10.03 -9.91 -9.80 -9.94 -9.98 -10.09 -9.82 -9.34 -8.94 -8.24 -7.41 -6.63 -6.06 -5.58 -5.19 -5.06 -5.10 -5.26 -5.45 -5.79 -5.81 -5.71 -5.61 -86.60 -105.69 -135.46 -142.65 -150.74 -158.77 -165.81 -171.65 -178.03 176.77 171.68 175.56 166.24 158.69 147.27 134.28 121.01 108.69 97.19 88.12 79.64 72.33 66.06 60.43 55.22 50.05 44.26 38.29 31.10 22.87 13.29 Device S-parameters are available for download off of the website at: http://www.wj.com Specifications and information are subject to change without notice WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com Page 6 of 6 June 2005 |
Price & Availability of AG604-89-RFID
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